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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6108 Issued Date : 1997.09.05 Revised Date : 2001.08.13 Page No. : 1/3
HA8550
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HA8550 is designed for use in 2W output amplifier of portable radios in class B push-pull operation.
Features
* High total power dissipation (PT: 2W, TC=25C) * High collector current (IC: 1.5A) * Complementary to HA8050
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ....................................................................................................... -55 ~ +150 C Junction Temperature................................................................................................ +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C)................................................................................................... 1 W Total Power Dissipation (Tc=25C) ................................................................................................... 2 W * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage.................................................................................................... -40 V VCEO Collector to Emitter Voltage................................................................................................. -25 V VEBO Emitter to Base Voltage......................................................................................................... -6 V IC Collector Current ..................................................................................................................... -1.5 A IB Base Current ............................................................................................................................ -0.5 A
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) VBE(on) *hFE1 *hFE2 *hFE3 fT Min. -40 -25 -6 45 85 40 100 Typ. Max. -100 -100 -0.5 -1.2 -1 500 Unit V V V nA nA V V V Test Conditions IC=-100uA IC=-2mA IE=-100uA VCB=-35V VEB=-6V IC=-0.8A, IB=-80mA IC=-0.8A, IB=-80mA VCE=-1V, IC=-10mA VCE=-1V, IC=-5mA VCE=-1V, IC=-100mA VCE=-1V, IC=-800mA VCE=-10V, IC=-50mA, f=100MHZ
MHz
*Pulse Test : Pulse Width 380us, Duty Cycle2%
Classification on hFE2
Rank Range
HA8550
C 120-200
D 160-320
E 250-500
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 10000
Spec. No. : HE6108 Issued Date : 1997.09.05 Revised Date : 2001.08.13 Page No. : 2/3
Saturation Voltage & Collector Current
Saturation Voltage (mV)
1000 VBE(sat) @ IC=10IB 100
hFE
100
10
VCE(sat) @ IC=10IB
10 0.1 1 10 100 1000 10000
1 0.1 1 10 100 1000 10000
Collector Curremt-IC (mA)
Collector Current-IC (mA)
On Voltage & Collector Current
10000 1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
On Voltage (mV)
VCE=10V 100
1000
VBE(on) @ VCE=1V
100 1 10 100 1000 10000
10 1 10 100 1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Capcitance & Reverse-Biased Voltage
100 10000 PT=1ms PT=100ms 1000
Safe Operating Area
Capacitance (pF)
Cob 10
Collector Current-IC (mA)
PT=1s
100
10
1 0.1 1 10 100
1 1 10 100
Reverse-Biased Voltage (V)
Forward Voltage-VCE (V)
HA8550
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
12 3
Spec. No. : HE6108 Issued Date : 1997.09.05 Revised Date : 2001.08.13 Page No. : 3/3
2
Marking :
HSMC Logo Part Number Date Code Rank Product Series
3
Laser Mark
HSMC Logo Product Series
C
D
Part Number
H I E F
G
Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector
1
3-Lead TO-92 Plastic Package HSMC Package Code : A
*:Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931
HA8550
HSMC Product Specification


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